Gc G-Premio Bond

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8thGeneration Bonding Agent (Non-HEMA)
4450 4500
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GC G-Premio BOND

  • G-Premio BOND is a universal, 8th generation bonding agent that is compatible with total-etch, self-etch and selective etch techniques providing excellent versatility. It is perfectly adapted to all direct restorations and can also be used to repair indirect restorations without the use of primer. G-Premio BOND can also be used in combination with a silane when repairing glass or hybrid ceramic and is also ideal for hypersensitivity. It is available in a bottle (5 mL) with a new silicone cover to enable more precise drop dispensing.


Outstanding performance with all etching modes and in all clinical situations.

A unique combination of three functional monomers (4-MET, MDP and MDTP), notably excluding HEMA, ensures excellent stability and exceptional bond strengths not just to tooth tissue but to all indirect substrates, including composites, precious and non-precious metals, zirconia and alumina for all repair cases.


How to Use:

Leave undisturbed for 10 seconds after application. Dry thoroughly for 5 seconds under MAXIMUM air pressure and light cure for 10 seconds. For the selective etching approach, apply 35% – 40% phosphoric acid on enamel for 10 seconds prior to the application of the bonding.


Application Time:

  • 30 seconds from application time to light-cure
  • Bonding Layer Thickness: Less than 3 µM






  • Can be used as self-etch adhesive or with selective etching of enamel
  • Creation of a nano-interaction zone for superior bond strength to both enamel and dentin
  • Excellent marginal integrity regardless of the technique and the composite material
  • HEMA-free for a long-lasting bond
  • Clinical reliability proven in independent tests
  • 5% filler seals tubules leads to fewer voids between the thin adhesive layer and the dentin, which minimizes microleakage and prevents microbial invasion
  • Available in updated-design bottle or unit dose delivery



  •  Low pH (1.5) provides effective and consistent bonding
  •  Use in all total-etch, self-etch and selective etch bonding techniques
  •  Low film thickness (3 microns) enables use with resin cements to bond indirect restorations
  •  Universal (8th generation) bonding agent for use in direct and indirect procedures and treatment of hypersensitivity
  • Up to 5 minutes working time
  • Consistent bond strength with easy application
  •  Better dispensing control and less waste with new silicone bottle design.
  •  Fast technique (10 second placement and 25 seconds before placing composite)





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